Title :
A novel eco-friendly bath for electroless copper deposition
Author :
Rekha, S. ; Srinvasan, K.N.
Author_Institution :
RMD Eng. Coll., RSM Nagar, Chennai, India
Abstract :
Methane sulphonic acid is most promising eco friendly acid replacing highly polluting acids like HF. In this study a novel eco friendly electroless copper methane sulphonate bath has been developed. The source material is copper methane sulphonate, which has high solubility, EDTA as chelating agent, glyoxylic acid as chelating agent and NaOH is used as a pH adjuster. The bath is optimized for the parameters affecting the rate of deposition. SEM studies shows refined grain size and thus a promising eco-friendly bath is developed.
Keywords :
copper compounds; electroless deposition; grain refinement; grain size; pollution control; scanning electron microscopy; CuS; EDTA; SEM; chelating agent; ecofriendly acid; ecofriendly electroless copper methane sulphonate bath; electroless copper deposition; glyoxylic acid; grain size refinement; methane sulphonic acid; scanning electron microscopy; Compounds; Copper; Films; RNA; Thermal stability; X-ray scattering; Electroless copper; Glyoxylic acid; Methane sulfonic acid; weight gain;
Conference_Titel :
Green Technology and Environmental Conservation (GTEC 2011), 2011 International Conference on
Conference_Location :
Chennai
Print_ISBN :
978-1-4673-0179-4
DOI :
10.1109/GTEC.2011.6167666
