DocumentCode
3530263
Title
A novel eco-friendly bath for electroless copper deposition
Author
Rekha, S. ; Srinvasan, K.N.
Author_Institution
RMD Eng. Coll., RSM Nagar, Chennai, India
fYear
2011
fDate
15-17 Dec. 2011
Firstpage
182
Lastpage
184
Abstract
Methane sulphonic acid is most promising eco friendly acid replacing highly polluting acids like HF. In this study a novel eco friendly electroless copper methane sulphonate bath has been developed. The source material is copper methane sulphonate, which has high solubility, EDTA as chelating agent, glyoxylic acid as chelating agent and NaOH is used as a pH adjuster. The bath is optimized for the parameters affecting the rate of deposition. SEM studies shows refined grain size and thus a promising eco-friendly bath is developed.
Keywords
copper compounds; electroless deposition; grain refinement; grain size; pollution control; scanning electron microscopy; CuS; EDTA; SEM; chelating agent; ecofriendly acid; ecofriendly electroless copper methane sulphonate bath; electroless copper deposition; glyoxylic acid; grain size refinement; methane sulphonic acid; scanning electron microscopy; Compounds; Copper; Films; RNA; Thermal stability; X-ray scattering; Electroless copper; Glyoxylic acid; Methane sulfonic acid; weight gain;
fLanguage
English
Publisher
ieee
Conference_Titel
Green Technology and Environmental Conservation (GTEC 2011), 2011 International Conference on
Conference_Location
Chennai
Print_ISBN
978-1-4673-0179-4
Type
conf
DOI
10.1109/GTEC.2011.6167666
Filename
6167666
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