• DocumentCode
    353039
  • Title

    A highly integrated dual-band tri-mode transceiver chipset for CDMA TIA/EIA-95 and AMPS applications

  • Author

    Robinson, T. ; Agamral, B. ; Lloyd, S. ; Piriyapoksombut, P. ; Rampmeier, K. ; Reddy, M. ; Yates, D.

  • Author_Institution
    Conexant Syst. Inc., Newport Beach, CA, USA
  • Volume
    1
  • fYear
    2000
  • fDate
    11-16 June 2000
  • Firstpage
    265
  • Abstract
    In this paper, a two device chip-set integrating the RF transceiver front-end function for the dual-band, dual-mode CDMA/AMPS cellular telephone standard TIA/EIA-98 is described. Fabricated in a double polysilicon, 25 GHz f/sub T/, silicon bipolar process, the transceiver achieves a total power dissipation of less than 480 mW at 3 V with 9 dBm transmitter power.
  • Keywords
    cellular radio; code division multiple access; telecommunication standards; telephone sets; transceivers; 25 GHz; 3 V; AMPS applications; CDMA TIA/EIA-95; RF transceiver front-end function; cellular telephone standard; dual-band tri-mode transceiver chipset; total power dissipation; transmitter power; Dual band; Energy consumption; Filters; Linearity; Multiaccess communication; Noise figure; Personal communication networks; Radio frequency; Radiofrequency amplifiers; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest. 2000 IEEE MTT-S International
  • Conference_Location
    Boston, MA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-5687-X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2000.860971
  • Filename
    860971
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=353039