DocumentCode :
3530520
Title :
Kondo resonance in magnetic double tunnel junctions
Author :
Yang, Hyunsoo ; Yang, See-Hun ; Kaiser, Christian ; Parkin, Stuart
Author_Institution :
IBM Almaden Res. Center, San Jose, CA, USA
fYear :
2005
fDate :
4-8 April 2005
Firstpage :
481
Lastpage :
482
Abstract :
The magneto-transport properties of double tunnel junctions are reported as a function of temperature and bias. The double tunnel junctions were formed with MgO tunnel barriers and CoFe magnetic electrodes in which the middle electrode is comprised of ultra-thin CoFe layers. Double magnetic tunnel junctions, comprised of CoFe/MgO/CoFe/MgO/CoFe, were deposited on SiO2 through a sequence of metal shadow masks using dc magnetron sputtering at room temperature. Tunneling magnetoresistance and AC conductance measurements show a peak in the conductance at low bias voltages and temperatures (below ∼50 K) and a strong suppression of tunneling magnetoresistance in the same bias voltage and temperature regime. These features are strongly reminiscent of Kondo resonance effects previously observed previously in lithographically defined quantum dots and C60 molecules placed between ferromagnetic electrodes.
Keywords :
Kondo effect; cobalt alloys; electric admittance; electrodes; ferromagnetic materials; iron alloys; magnesium compounds; magnetic multilayers; magnetic thin films; sputtered coatings; tunnelling magnetoresistance; 293 to 298 K; AC conductance measurements; CoFe-MgO-CoFe-MgO-CoFe; Kondo resonance effect; SiO2; dc magnetron sputtering; double magnetic tunnel junctions; ferromagnetic electrodes; magnetic electrodes; magnetotransport properties; metal shadow masks; room temperature; tunnel barriers; tunneling magnetoresistance; ultrathin layers; Electrodes; Impurities; Low voltage; Magnetic resonance; Magnetic sensors; Magnetic tunneling; Memory; Temperature dependence; Temperature sensors; Tunneling magnetoresistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
Print_ISBN :
0-7803-9009-1
Type :
conf
DOI :
10.1109/INTMAG.2005.1463669
Filename :
1463669
Link To Document :
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