Title :
70 nm low-noise metamorphic HEMT technology on 4 inch GaAs wafers
Author :
Leuther, Amulf ; Tessmann, Axel ; Dammann, Michael ; Reinert, Wemer ; Schlechtweg, Michael ; Mikulla, Michael ; Walther, Martin ; Weimann, G.
Author_Institution :
Fraunhofer Inst. Appl. Solid-State Phys., Freiburg, Germany
Abstract :
A 70 nm gate length metamorphic HEMT technology will be presented. Extrinsic cut-off frequencies of ft = 293 GHz and fmax = 337 GHz were achieved. The transistors have an on-state breakdown voltage of 1.7 V. A median time to failure of 1×106 h at 125°C and an activation energy of 1.3 eV was extrapolated based on a 10% gm,max degradation in air. This is significant less than the 1.8 eV activation energy of our 100 nm gate-length 65% In process which is probably due to hot electron effects. The MMIC-process obtains high yields on transistor and circuit level. Low-noise amplifiers demonstrate a small signal gain of 13 dB and a noise figure of 2.8 dB at 94 GHz. The achieved results are comparable to state-of-the-art InP-based HEMT technologies.
Keywords :
gallium arsenide; high electron mobility transistors; semiconductor device breakdown; semiconductor device measurement; semiconductor device noise; 1×106 h; 1.3 eV; 1.7 V; 125 degC; 13 dB; 2.8 dB; 4 inch; 70 nm; 94 GHz; GaAs; GaAs wafers; MMIC-process; hot electron effects; low-noise metamorphic HEMT technology; median time to failure; noise figure; on-state breakdown voltage; Circuits; Cutoff frequency; Degradation; Electrons; Gain; Gallium arsenide; HEMTs; Low-noise amplifiers; Noise figure; mHEMTs;
Conference_Titel :
Indium Phosphide and Related Materials, 2003. International Conference on
Print_ISBN :
0-7803-7704-4
DOI :
10.1109/ICIPRM.2003.1205352