• DocumentCode
    3531211
  • Title

    3DAP analysis of FeCo electrodeposited soft magnetic films with high Bs

  • Author

    Takahashi, Y.K. ; Hono, K. ; Miyake, Y. ; Kaneko, D. ; Kanai, H.

  • Author_Institution
    Nat. Inst. for Mater. Sci., Tsukuba, Japan
  • fYear
    2005
  • fDate
    4-8 April 2005
  • Firstpage
    565
  • Lastpage
    566
  • Abstract
    In this paper soft magnetic FeCo films were electrodeposited in two different electroplating baths with pulse current, one contained NaCl, the other contained KCl as electroconductivity investor. This however, have slightly lower Bs than that of the sputtered film. One of the reasons for the lower Bs is thought to be the effect of impurities. In order to clarify the effect of impurities of Bs we have investigated the microstructures and the local chemistries of the FeCo films. Magnetic properties were measured by a VSM and a SQUID magnetometer and the microstructures were characterized by a transmission electron microscopy (TEM) and a three-dimensional atom probe (3DAP). Results show that low Bs is attributed to the low magnetization in the grain boundaries.
  • Keywords
    SQUID magnetometers; atom probe field ion microscopy; cobalt alloys; electrodeposition; grain boundaries; impurities; iron alloys; magnetic flux; magnetic thin films; magnetisation; nickel alloys; potassium compounds; sodium compounds; soft magnetic materials; sputtering; titanium; transmission electron microscopy; FeCo; KCl; NaCl; SQUID magnetometer; Si; TEM; VSM; electroconductivity investor; electrodeposition; electroplating baths; grain boundaries; magnetic properties; magnetization; microstructures; pulse current; soft magnetic FeCo films; three dimensional atom probe analysis; Atomic measurements; Chemistry; Impurities; Kirchhoff´s Law; Magnetic analysis; Magnetic films; Magnetic properties; Microstructure; SQUID magnetometers; Soft magnetic materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
  • Print_ISBN
    0-7803-9009-1
  • Type

    conf

  • DOI
    10.1109/INTMAG.2005.1463711
  • Filename
    1463711