• DocumentCode
    3531295
  • Title

    Optimizing device size for soft error resilience in sub-micron logic circuits

  • Author

    Sootkaneung, Warin ; Saluja, Kewal K.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Wisconsin-Madison, Madison, WI, USA
  • fYear
    2010
  • fDate
    3-4 Aug. 2010
  • Firstpage
    235
  • Lastpage
    242
  • Abstract
    As technology nodes are being scaled down, soft errors induced by particle strikes are becoming a troublesome reliability issue in logic circuits. Various sizing techniques commonly used to reduce soft error rate in the past are expensive in terms of area, performance, and energy consumption. These methods require changes to adapt to sub-micron technologies. This study introduces two novel sizing methods that selectively upsize transistor networks of a circuit. Our first proposed methodology formulates the soft error rate minimization as a mathematical optimization problem and searches for the best area distribution such that maximum reliability gain is obtained. This methodology assures that optimal solutions are achieved within given area budget provided to the designer. However, generating optimal solution requires very high CPU time. Therefore, we propose a heuristic based methodology which upsizes only selected transistor network in sensitive gates based on soft error sensitivity of each gate. With proper sensitive gate selection and area distribution algorithms proposed in this technique, we show through experimental results that our heuristic driven method gives satisfactory reliability improvement compared to our first method, while requiring relatively small computation time.
  • Keywords
    integrated circuit reliability; logic circuits; optimisation; best area distribution; device size; mathematical optimization problem; maximum reliability gain; particle strikes; reliability issue; sensitive gate selection; soft error rate minimization; soft error resilience; submicron logic circuits; transistor networks; Computer errors; Degradation; Error analysis; Error correction codes; Logic circuits; Neutrons; Packaging; Protection; Registers; Resilience; Soft error; circuit reliability; optimization; sizing technique;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ASQED), 2010 2nd Asia Symposium on
  • Conference_Location
    Penang
  • Print_ISBN
    978-1-4244-7809-5
  • Type

    conf

  • DOI
    10.1109/ASQED.2010.5548249
  • Filename
    5548249