• DocumentCode
    3531699
  • Title

    A Novel Encoding Scheme for Low Power in Network on Chip Links

  • Author

    Sarma, Deepa N. ; Lakshminarayanan, G. ; Chavali, R. Suryakiran K V

  • Author_Institution
    Dept. of ECE, Nat. Inst. of Technol., Tiruchirapalli, India
  • fYear
    2012
  • fDate
    7-11 Jan. 2012
  • Firstpage
    257
  • Lastpage
    261
  • Abstract
    Dynamic power dissipation in interconnects is a major contributor to power consumption in Network on Chips (NoCs). This is mainly due to two factors, self switching activity of the particular link and coupling switching activity among adjacent links. Two novel techniques are proposed to reduce power consumption due to switching transition and cross talk. First technique reorders the data in such a way that switching transition is brought down. In the second technique, it is ensured that power consumption due to cross coupling activity is reduced. An end to end encoding scheme facilitating two stage coding to reduce power consumption in wormhole routed network on chip is designed using the proposed power reduction techniques. Encoder and Decoder exhibiting the proposed scheme have been described in RTL level in Verilog HDL, synthesized and mapped into UMC180 nm technology library. It has been observed that the proposed technique (TSC) offers an average reduction in dynamic power consumption of 17.34%. Proposed scheme was compared with existing techniques and observations concluded that there was not much degradation in area, speed and static power dissipation. Power reduction when subjected to different kinds of data streams was analyzed and results indicate that proposed scheme offers uniform power reduction irrespective of the nature of data stream unlike the existing techniques.
  • Keywords
    encoding; hardware description languages; integrated circuit interconnections; network-on-chip; NoC; RTL level; UMC technology; Verilog HDL; data streams; dynamic power consumption reduction; dynamic power dissipation; encoding scheme; network on chip links; size 180 nm; speed power dissipation; static power dissipation; Bismuth; Capacitance; Couplings; Decoding; Encoding; Switches; System-on-a-chip; Network on Chip links; analysis; crosstalk; low power; self switching; two stage coding; uniform power reduction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design (VLSID), 2012 25th International Conference on
  • Conference_Location
    Hyderabad
  • ISSN
    1063-9667
  • Print_ISBN
    978-1-4673-0438-2
  • Type

    conf

  • DOI
    10.1109/VLSID.2012.80
  • Filename
    6167761