Failure Analysis on the BGA Solder Joint

Author

Mo Yunqi ; He Wei ; Wang Shou-Xu ; Wang Yang ; Wu Xiang-Hao ; He Bo ; Zhang Xuan-Dong

Author_Institution

Dept. of Appl. Chem., Univ. of Electron. Sci. Technol. of China, Chengdu

fYear

2009

fDate

28-29 April 2009

Firstpage

1

Lastpage

3

Abstract

The analysis process and methods of a failure BGA solder joint have been studied by a failure analysis case for an actual BGA package sample with XRD, cross section analysis and SEM&EDS analysis. The analysis results show that the cracks are the main failure causes of the BGA solder joints. The position of cracks appeard between the IMC and PCB pad and the interface of solder and IMC. The main reason of cracks is that excessively thick and irregular Sn-Ag and Sn-Cu IMC reduced the mechanical robustness of the solder joints and when the solder joints were subject to external stress, cracking occurred. The contribution of failure analysis to quality control of BGA mounting was also displayed.

Keywords

X-ray diffraction; ball grid arrays; failure analysis; mountings; scanning electron microscopy; solders; BGA; EDS; SEM; XRD; cross section analysis; failure analysis; mountings; solder joint; Chemical technology; Electronics packaging; Failure analysis; Helium; Intermetallic; Scanning electron microscopy; Soldering; Tensile stress; X-ray detection; X-ray scattering;

fLanguage

English

Publisher

ieee

Conference_Titel

Testing and Diagnosis, 2009. ICTD 2009. IEEE Circuits and Systems International Conference on

Conference_Location

Chengdu

Print_ISBN

978-1-4244-2587-7

Type

conf

DOI

10.1109/CAS-ICTD.2009.4960817

Filename

4960817