• DocumentCode
    3532664
  • Title

    Failure Analysis on the Chip Capacitor

  • Author

    Wang Yang ; He Wei ; Mo Yunqi ; Wang Shou-Xu ; Wu Xiang-Hao ; He Bo ; Zhang Xuan-Dong

  • Author_Institution
    Reliability Res. & Anal. Center, MII, Guangzhou
  • fYear
    2009
  • fDate
    28-29 April 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The analysis process and methods of a failure chip capacitor have been introduced by a failure analysis case for an actual chip capacitor with visual inspection, cross section analysis and SEM & EDS analysis. The analysis results show that the parallel resistance characteristic existed in chip capacitor is main cause for failure; The crack existed in ceramic dielectric materials between two electrodes of multilayer capacitor was arisen from chip capacitor manufacture obviously. The contribution of failure analysis to quality control of manufacturing process of semiconductor was also displayed.
  • Keywords
    ceramic capacitors; failure analysis; inspection; scanning electron microscopy; EDS analysis; SEM analysis; ceramic dielectric materials; cross section analysis; electrodes; failure analysis; failure chip capacitor; manufacturing process; multilayer capacitor; parallel resistance; quality control; visual inspection; Capacitors; Ceramics; Dielectric materials; Electrodes; Failure analysis; Inspection; Manufacturing processes; Nonhomogeneous media; Quality control; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Testing and Diagnosis, 2009. ICTD 2009. IEEE Circuits and Systems International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-2587-7
  • Type

    conf

  • DOI
    10.1109/CAS-ICTD.2009.4960818
  • Filename
    4960818