DocumentCode :
3532664
Title :
Failure Analysis on the Chip Capacitor
Author :
Wang Yang ; He Wei ; Mo Yunqi ; Wang Shou-Xu ; Wu Xiang-Hao ; He Bo ; Zhang Xuan-Dong
Author_Institution :
Reliability Res. & Anal. Center, MII, Guangzhou
fYear :
2009
fDate :
28-29 April 2009
Firstpage :
1
Lastpage :
4
Abstract :
The analysis process and methods of a failure chip capacitor have been introduced by a failure analysis case for an actual chip capacitor with visual inspection, cross section analysis and SEM & EDS analysis. The analysis results show that the parallel resistance characteristic existed in chip capacitor is main cause for failure; The crack existed in ceramic dielectric materials between two electrodes of multilayer capacitor was arisen from chip capacitor manufacture obviously. The contribution of failure analysis to quality control of manufacturing process of semiconductor was also displayed.
Keywords :
ceramic capacitors; failure analysis; inspection; scanning electron microscopy; EDS analysis; SEM analysis; ceramic dielectric materials; cross section analysis; electrodes; failure analysis; failure chip capacitor; manufacturing process; multilayer capacitor; parallel resistance; quality control; visual inspection; Capacitors; Ceramics; Dielectric materials; Electrodes; Failure analysis; Inspection; Manufacturing processes; Nonhomogeneous media; Quality control; Semiconductor device manufacture;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Testing and Diagnosis, 2009. ICTD 2009. IEEE Circuits and Systems International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-2587-7
Type :
conf
DOI :
10.1109/CAS-ICTD.2009.4960818
Filename :
4960818
Link To Document :
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