DocumentCode
3532917
Title
Temperature control for reduced thermal cycling of power devices
Author
Xiang Wang ; Castellazzi, Alberto ; Zanchetta, Pericle
Author_Institution
Univ. of Nottingham, Nottingham, UK
fYear
2013
fDate
2-6 Sept. 2013
Firstpage
1
Lastpage
10
Abstract
This paper presents a design and experimental validation of a temperature feedback control scheme to realize the reduction of temperature variation amplitude of power devices or modules. A full-order observer state-space thermal model enables estimation and control of the temperature at reliability critical locations only measuring one accessible location.
Keywords
observers; power semiconductor devices; reliability; temperature control; full-order observer; power devices; power modules; reduced thermal cycling; reliability critical locations; state-space thermal model; temperature feedback control; temperature variation amplitude; Cooling; Multichip modules; Reliability; Temperature measurement; Temperature sensors; Thermal stresses; Cooling; Power cycling; Reliability; Thermal design; Thermal stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Applications (EPE), 2013 15th European Conference on
Conference_Location
Lille
Type
conf
DOI
10.1109/EPE.2013.6631742
Filename
6631742
Link To Document