DocumentCode
3532921
Title
Protein supporting structure discovery by rigid structure identification via one-dimensional structural signature
Author
Huang, Yu-Feng ; Yang, Chia-Jui ; Yang, Yi-Wei ; Huang, Chun-Chin ; Huang, Chien-Kang
Author_Institution
Dept. of Comput. Sci. & Inf. Eng., Nat. Taiwan Univ., Taipei
fYear
2008
fDate
3-5 Nov. 2008
Firstpage
9
Lastpage
16
Abstract
Protein function is highly correlated with its three-dimensional conformation in order to interact with others proteins, ligands, substrates, inhibitors, etc. Studies on binding site and protein function have been investigated to understand the mechanism of protein activity. The role of binding site can be characterized by the presence of stable regions and flexible regions. Furthermore, protein stability and flexibility play different roles on protein functions. In this work, we propose the framework to discover protein supporting structure by identifying rigid regions among different structure of same/similar proteins. By encoding spatial information of protein structure into structural signature, we can reduce comparison time without losing accuracy, in comparison with the time complexity of structure comparison using geometric hashing approach. Our results reveal that supporting structure can be discovered in selected enzyme families. Moreover, supporting structure plays different roles depend on the mechanism of protein activity of protein family.
Keywords
biology computing; encoding; enzymes; molecular biophysics; molecular configurations; binding site; encoding; enzyme; one-dimensional structural signature; protein activity; protein flexibility; protein function; protein stability; protein supporting structure discovery; rigid structure identification; three-dimensional conformation; Biochemistry; Computer science; Encoding; Inhibitors; Libraries; Nuclear magnetic resonance; Oceans; Protein engineering; Sequences; Stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Bioinformatics and Biomeidcine Workshops, 2008. BIBMW 2008. IEEE International Conference on
Conference_Location
Philadelphia, PA
Print_ISBN
978-1-4244-2890-8
Type
conf
DOI
10.1109/BIBMW.2008.4686203
Filename
4686203
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