Feasibility study for thermal conductivity simulation by coupling between admittance matrix method and finite elemental method

We developed a new method of coupling the finite elemental method (FEM) with the admittance matrix method to simulate the thermal conductivity of large-scale power electronics systems. The feasibility of this method was confirmed from the simulation results that showed the temperature changes differing by 6.5% from those obtained by using the conventional FEM. The accuracy was improved more so that it can be used even if the Y region is divided into several Y blocks. The FEM-Y matrix coupling method also proved to be effective for ensuring there was less calculation time compared to that for the conventional FEM. The FEM-Y matrix coupling method was confirmed to reduce the calculation time by 48% or more when compared to the conventional FEM, based on the number of times the thermal conductivity analysis is iterated.