DocumentCode :
3533451
Title :
Component level modular design of a Solid State X-ray Image Intensifier for an M×N array
Author :
Huang, Ying ; Qu, Bin ; Sharma, Prateek ; Kuhls-Gilcrist, Andrew ; Wang, Weiyuan ; Titus, Albert H. ; Cartwright, Alexander N. ; Bednarek, Daniel R. ; Rudin, Stephen
Author_Institution :
Dept. of Electr. Eng., SUNY - Univ. at Buffalo, Buffalo, NY, USA
fYear :
2010
fDate :
Oct. 30 2010-Nov. 6 2010
Firstpage :
2714
Lastpage :
2717
Abstract :
The Solid-State X-ray Image Intensifier (SSXII) is a novel dynamic x-ray imager, based on an array of electron-multiplying CCDs (EMCCDs), that can significantly improve performance compared to conventional x-ray image intensifiers (XIIs) and flat panel detectors (FPDs). To expand the field-of-view (FOV) of the SSXII detectors while maintaining high resolution, a scalable component level modular design is presented. Each module can be fit together with minimum dead-space and optically coupled to one contiguous x-ray converter plate. The electronics of each of the modules consists of a detachable head-board, on which is mounted the EMCCD, and a driver board. The size of the head-boards is minimized to ensure that the modules fit together properly. The driver boards connect with the head-boards via flat cables and are designed to be plugged into the main mother-board that contains an FPGA chip that generates the driving clock signals for the EMCCDs and analog-to-digital converter (ADC). At the front-end, a high speed ADC on each of the driver boards samples and digitizes the EMCCD analog output signal and an extensible modular digital multiplexer back-end is used to acquire and combine image data from multiple modules. The combined digital data is then transmitted to a PC via a standard Camera Link interface. Eventually, this modular design will be extended to a 3×3 or larger array to accomplish full clinical FOVs and enable the SSXII to replace conventional lower-resolution XIIs or FPDs.
Keywords :
CCD image sensors; analogue-digital conversion; diagnostic radiography; field programmable gate arrays; image intensifiers; FPGA chip; M×N array; analog-to-digital converter; component level modular design; detachable headboard; driver board; driving clock signals; dynamic X-ray imager; electron-multiplying CCD; flat panel detectors; motherboard; solid state X-ray image intensifier; standard camera link interface; Arrays; Driver circuits; High speed optical techniques; Optical imaging; Optical sensors; Pixel; X-ray imaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nuclear Science Symposium Conference Record (NSS/MIC), 2010 IEEE
Conference_Location :
Knoxville, TN
ISSN :
1095-7863
Print_ISBN :
978-1-4244-9106-3
Type :
conf
DOI :
10.1109/NSSMIC.2010.5874284
Filename :
5874284
Link To Document :
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