Title :
Effect of TiO2 and oMMT nanofiller on thermal conductivity and heat deflection temperature of nanodielectric composites
Author :
Renukappaa, N.M. ; Rashmi ; Shivakumar, K.N. ; Manjunatha, M. ; Sampath Kumaran, P.
Author_Institution :
Dept. of Electron. & Commun, S.J. Coll. of Eng., Mysore, India
Abstract :
This paper focuses on thermal conductivity and heat deflection temperature (HDT) of Epoxy-oMMT, Epoxy-TiO2 and Vinyl ester-oMMT nanocomposites with 2, 5 and 7 wt.% were prepared using high shear mixing technique with suitable curing cycles and operating speed. The thermal conductivity and HDT was measured using the Unithermo model 2022, as per ASTME-1530(2011) and Tinius Olsen as per ASTM D-648(2007) at 1-8 Mpa of loading. The thermal conductivity and HDT increases with the addition of oMMT and TiO2 nanofiller indicating the formation of a percolative heat sink pathway. Further, thermal conductivity and HDT data obtained both from experiment and analytical estimations have shown good agreement.
Keywords :
curing; dielectric materials; filled polymers; mixing; nanocomposites; nanofabrication; resins; semiconductor materials; thermal conductivity; titanium compounds; TiO2; Unithermo model 2022; curing; heat deflection temperature; nanodielectric composites; nanofiller; percolative heat sink pathway; shear mixing; thermal conductivity; vinyl ester-oMMT nanocomposites; Heating; Measurement units; Nanocomposites; Numerical models; Polymers; Predictive models; USA Councils; Heat deflection temperature; Nanocomposites; Thermal conductivity;
Conference_Titel :
Properties and Applications of Dielectric Materials (ICPADM), 2012 IEEE 10th International Conference on the
Conference_Location :
Bangalore
Print_ISBN :
978-1-4673-2852-4
DOI :
10.1109/ICPADM.2012.6318913
