DocumentCode :
3535410
Title :
High efficiency operation of 6-H SiC MESFETs at 6 GHz
Author :
Sriram, S. ; Barron, R. ; Morse, A.W. ; Smith, T.J. ; Augustine, G. ; Burk, A.A., Jr. ; Clarke, R.C. ; Glass, R.C. ; Hobgood, H.M. ; Orphanos, P.A. ; Siergiej, R.R. ; Brandt, C.D. ; Driver, M.C. ; Hopkins, R.H.
Author_Institution :
Sci. & Technol. Center, Westinghouse Electr. Corp., Pittsburgh, PA, USA
fYear :
1995
fDate :
19-21 June 1995
Firstpage :
104
Lastpage :
105
Abstract :
Summary form only given. SiC MESFETs are very promising candidates for RF power amplification, due to their unique combination of high saturation velocity, high breakdown strength, and high thermal conductivity. In the present work, we demonstrate for the first time high efficiency RF power operation at 6 GHz. We have obtained power output of 35 W, with 45.5% power added efficiency at 6 GHz from a 6-H SiC MESFET operating at a drain bias of 40 V. The gate length and width were 0.5 /spl mu/m and 2 mm respectively. The corresponding power density is 1.75 W/mm and is more than a factor of 3 higher than that obtained normally in GaAs. To our knowledge, these results represent the highest power output, efficiency, and operating frequency reported to date in SiC. The power MESFETs were fabricated on high resistivity SiC substrates grown at Westinghouse. Sintered Ni ohmic contacts, mesa isolation, and channel recessing using RIE were used in device fabrication. Air-bridge source interconnects were used for large periphery devices. The fabrication and characterization of these SiC power MESFETs are presented.
Keywords :
microwave field effect transistors; microwave power transistors; power MESFET; power field effect transistors; silicon compounds; wide band gap semiconductors; 0.5 micron; 3.5 W; 40 V; 45.4 percent; 6 GHz; 6-H SiC MESFET; RIE; SHF; SiC; SiC-Ni; air-bridge source interconnects; channel recessing; characterization; device fabrication; high efficiency operation; high resistivity SiC substrates; large periphery devices; mesa isolation; operating frequency; power MESFETs; power amplification; sintered Ni ohmic contacts; Contracts; Driver circuits; Electric breakdown; Electrons; Fabrication; Glass; MESFETs; Radio frequency; Silicon carbide; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference, 1995. Digest. 1995 53rd Annual
Conference_Location :
Charlottesville, VA, USA
Print_ISBN :
0-7803-2788-8
Type :
conf
DOI :
10.1109/DRC.1995.496290
Filename :
496290
Link To Document :
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