DocumentCode :
3535518
Title :
Electric Field distribution on four-bundle conductors in 750 kV AC substation
Author :
Liao, Jintao ; Peng, Zongren ; Zhang, Liangxian ; Zhang, Shiling ; Li, Naiyi ; Li, Jing
Author_Institution :
State Key Lab. of Electr. Insulation & Power Equip., Xi´´an Jiaotong Univ., Xi´´an, China
fYear :
2012
fDate :
24-28 July 2012
Firstpage :
1
Lastpage :
4
Abstract :
In high altitude areas of northwest China, the corona activity of conductors is serious in 750 kV AC substations, which may lead to severe electromagnetic environmental problems. According to the research and field experience, determination of adequate parameters of conductors is intended to solve these problems. In this paper, the critical E-Field value is obtained by Peek´s empirical formula and this provides a reference for the optimization. Using a three-dimensional FEM model, factors that affect the E-Field distribution on four-bundle conductors are discussed and recommendations on diameter and bundle spacing are obtained. The optimization can result in reduction of the corona discharge on the conductors. The derived conclusions can provide experiences and references for the design of conductors in 750 kV AC substation.
Keywords :
conductors (electric); corona; finite element analysis; optimisation; substations; AC substation; Peek empirical formula; bundle spacing; corona activity; critical E-Field value; electric field distribution; electromagnetic environmental problems; four-bundle conductors; northwest China; three-dimensional FEM model; voltage 750 kV; Conductors; Corona; Lead; Optimization; Poles and towers; Substations; 750 kV AC substation; bundled conductors; corona discharge; surface E-Field intensity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials (ICPADM), 2012 IEEE 10th International Conference on the
Conference_Location :
Bangalore
ISSN :
2160-9225
Print_ISBN :
978-1-4673-2852-4
Type :
conf
DOI :
10.1109/ICPADM.2012.6318942
Filename :
6318942
Link To Document :
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