• DocumentCode
    3535707
  • Title

    Examination of circuit parameter for stable high efficiency TETS for the artificial hearts

  • Author

    Arai, Shmsuke ; Miura, Hidekam ; Satou, Fumihiro ; Matsuki, H. ; Satou, T.

  • Author_Institution
    Graduate Sch. of Eng., Tohoku Univ., Sendai, Japan
  • fYear
    2005
  • fDate
    4-8 April 2005
  • Firstpage
    1141
  • Lastpage
    1142
  • Abstract
    Artificial organs are hoped to solve problems such as lack of organ donors needed for organ transplant. In order for artificial organs to function, electric power must be supplied from the outside of the body through the skin. However, the existence of the cable which penetrates through the skin limits the freedom of the behavior of the patient and causes the danger of infections. This paper focuses on the use of transcutaneous energy transmission system (TETS) as an answer to this dilemma. This method uses the principle of the electromagnetic induction using a transformer through the skin. However, the output voltage becomes unstable for the change of the distance between coils by the behavior of the patient and the change of the load. In addition, heat due to the electric power loss causes the body adverse effect. To solve such a problem, the circuit parameter that enables highly effective and stable operation is examined. The artificial organs targeted in this paper are artificial hearts.
  • Keywords
    artificial organs; bioelectric phenomena; biomagnetism; electromagnetic induction; skin; artificial hearts; artificial organs; circuit parameter; electric power; electric power loss; electromagnetic induction; organ transplant; output voltage; skin; stable high efficiency TETS; transcutaneous energy transmission system; transformer; Artificial biological organs; Artificial heart; Coils; Educational institutions; Equivalent circuits; Impedance; Power engineering and energy; Power supplies; Skin; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
  • Print_ISBN
    0-7803-9009-1
  • Type

    conf

  • DOI
    10.1109/INTMAG.2005.1464000
  • Filename
    1464000