Title :
Fabrication and dynamic testing of electrostatic actuators with p + silicon diaphragms
Author :
Yang, E.H. ; Yang, S.S. ; Han, S.W. ; Kim, S.Y.
Author_Institution :
Dept. of Control & Instrum. Eng., Ajou Univ., Suwon, South Korea
Abstract :
This paper presents the fabrication and testing of electrostatic actuators. The p+ diaphragm is used as a moving electrode, whereas the aluminum layer deposited on a #7740 pyrex glass is used as a fixed electrode. The dynamic characteristics of the actuator with the corrugated diaphragm and that with the flat one are tested and compared with the calculation results, respectively
Keywords :
diaphragms; electrostatic devices; elemental semiconductors; microactuators; silicon; #7740 pyrex glass; Si; aluminum layer; corrugated diaphragm; dynamic testing; electrostatic actuators; fabrication; flat diaphragm; p+ silicon diaphragm; Aluminum; Electrodes; Electrostatic actuators; Fabrication; Glass; Microactuators; Residual stresses; Silicon; Tensile stress; Testing;
Conference_Titel :
Microelectronics and VLSI, 1995. TENCON '95., IEEE Region 10 International Conference on
Print_ISBN :
0-7803-2624-5
DOI :
10.1109/TENCON.1995.496327
