Title :
Table of contents
Abstract :
This paper dealt with the following topics: MR heads; RFIC and novel protection devices; system level and other ESD issues; on-chip protection strategies, physics, and modeling; devices effects tester; ESD design failures analysis and modeling; factory and materials; on-chip protection characterization; novel LTP testers; and, magnetic recording heads.
Keywords :
electrostatic discharge; failure analysis; magnetic recording; radiofrequency integrated circuits; ESD design failures; LTP testers; MR heads; RFIC; devices effects tester; factory; magnetic recording heads; on-chip protection strategies; protection devices; system level;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2004. EOS/ESD '04.
Conference_Location :
Grapevine, TX
Print_ISBN :
978-1-5853-7063-4
DOI :
10.1109/EOSESD.2004.5272646
