DocumentCode
3536230
Title
Application of RVM technique to study the polarisation and depolarisation characteristics associated with thermal ageing of epoxy mica composite
Author
Rao, B. Nageshwar ; Rajan, J. Sundara ; Ramachandra, B.
Author_Institution
Central Power Res. Inst., Bangalore, India
fYear
2012
fDate
24-28 July 2012
Firstpage
1
Lastpage
4
Abstract
The Recovery voltage measurement technique was used to investigate the polarization processes in the dielectric to assess the insulation ageing. Two different types of insulation systems are evaluated, resin poor and resin rich mica composites. This paper presents and discusses the data on polarization and depolarization characteristics of thermally degraded epoxy mica composites. Beyond polarization spectrum, additional spectra slope spectrum and peak time spectrum of Recovery voltage measurement technique were used. The combined spectrum: a plot of initial slope (V/s) against Max. Recovered voltage, Vr(V) showed a clear peak in the form of “bun” and “nose” distinctly which probably could give more information on the bigger polar species and the polarization phenomena. Multiple peaks are seen in case of thermally aged samples which clearly exhibit the degradation phenomena.
Keywords
ageing; composite insulating materials; dielectric depolarisation; dielectric polarisation; mica; resins; voltage measurement; RVM technique; dielectric depolarisation characteristics; dielectric polarisation characteristics; epoxy mica composite; insulation ageing; insulation systems; polar species; polarization phenomena; polarization spectrum; recovery voltage measurement technique; resin rich mica composites; spectra slope spectrum; thermal ageing; thermally degraded epoxy mica composites; Aging; Atomic measurements; Dielectric measurements; Dielectrics; Resins; Thickness measurement; Voltage measurement; Epoxy-Mica; Recovery Voltage Measurement; chemical changes; structural changes;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials (ICPADM), 2012 IEEE 10th International Conference on the
Conference_Location
Bangalore
ISSN
2160-9225
Print_ISBN
978-1-4673-2852-4
Type
conf
DOI
10.1109/ICPADM.2012.6319010
Filename
6319010
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