Title :
VF-TLP systems using TDT and TDRT for kelvin wafer measurements and package level testing
Author :
Grund, Evan ; Gauthier, Robert
Author_Institution :
Oryx Instrum. Corp., Fremont, CA, USA
Abstract :
Very fast transmission line pulse (VF-TLP) systems described in the literature are time domain reflection (VF-TDR) configurations. Using other TLP configurations, VF-TLP systems can provide new capabilities. A wafer level Kelvin probe system was derived from VF-time domain transmission (VF-TDT). A test fixture board (TFB) using VF-time domain reflection and transmission (VF-TDRT) enables VF-TLP package level testing.
Keywords :
electronics packaging; time-domain analysis; transmission lines; Kelvin wafer measurements; VF-TLP systems; VF-time domain reflection and transmission; VF-time domain transmission; package level testing; test fixture board; very fast transmission line pulse; Cables; Fixtures; Kelvin; Packaging; Probes; Pulse measurements; Reflection; Space vector pulse width modulation; System testing; Voltage;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium, 2004. EOS/ESD '04.
Conference_Location :
Grapevine, TX
Print_ISBN :
978-1-5853-7063-4
Electronic_ISBN :
978-1-5853-7063-4
DOI :
10.1109/EOSESD.2004.5272811
