• DocumentCode
    3536474
  • Title

    Research on preparation technology and properties of mLLDPE/LDPE/CB composite with PTC

  • Author

    Wenlong Zhang ; Xu Hu ; Weiju Wu ; Yingchun Zhang

  • Author_Institution
    Coll. of Mater. Sci. & Eng., Harbin Univ. of Sci. & Technol., Harbin, China
  • fYear
    2012
  • fDate
    24-28 July 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    mLLDPE(metallocene polyethylene)/LDPE/CB(conductive carbon black) composite with positive temperature coefficient(PTC) was successfully prepared by blending. The rheology behavior and the strength of PTC of the composites were investigated through methods of rheometer test, resistance measurement, scanning electronic microscope (DSC) and scanning electron microscope (SEM) analysis. The results showed that CB can be uniformly dispersed in the mLLDPE / LDPE composite; mLLDPE/LDPE/CB composite has higher strength of PTC than this of the LDPE/CB composite. The PTC mutations temperature of mLLDPE/LDPE/CB composite increased from 358.7K to 377.3K, and also its PTC strength increased from 6.7 to 8.1 with the increasing of mLLDPE content (25wt%~75wt%) to compare with the PTC strength of traditional PTC polymer (LDPE / CB). The proper blend technology conditions of mixing rotation, temperature and time were 30r/min, 453K, 10min respectively.
  • Keywords
    blending; carbon; differential scanning calorimetry; filled polymers; materials preparation; polyethylene insulation; polymer blends; scanning electron microscopy; DSC; PTC polymer; SEM analysis; blend technology; blending; conductive carbon black composite; mLLDPE-LDPE-CB composite; metallocene polyethylene; mixing rotation; positive temperature coefficient; preparation technology; scanning electron microscope; scanning electronic microscope; temperature 453 K; time 10 min; Carbon; Fasteners; Rheology; PTC Properties; Preparation technology; mLLDPE;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials (ICPADM), 2012 IEEE 10th International Conference on the
  • Conference_Location
    Bangalore
  • ISSN
    2160-9225
  • Print_ISBN
    978-1-4673-2852-4
  • Type

    conf

  • DOI
    10.1109/ICPADM.2012.6319031
  • Filename
    6319031