DocumentCode
3537021
Title
A finite width impurity source model for linear doping profiles
Author
Lai, Tommy M L ; Sin, Johnny K O ; Ko, Ping K.
Author_Institution
Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Clear Water Bay, Hong Kong
fYear
1995
fDate
6-10 Nov 1995
Firstpage
432
Lastpage
435
Abstract
In order to provide high breakdown voltage in thin-film SOI devices, a linear doping profile in the drift region is needed. The linear doping profile can be obtained by using a lateral variation doping technique. In this technique, a smeared-out dopant distribution is implemented through the use of a sequence of small opening slits in the oxide with subsequent impurity implantation and drive-in processes. In this paper, an analytical model is presented to describe the impurity distribution of a finite width impurity source which is used to form the linear doping profile. This model provides a basis for determination of the slits width and silts spacing which are required to implement the linear doping profile
Keywords
doping profiles; impurity distribution; ion implantation; semiconductor process modelling; silicon-on-insulator; analytical model; drift region; drive-in processes; finite width impurity source model; high breakdown voltage; impurity distribution; impurity implantation; lateral variation doping technique; linear doping profiles; silt spacing; slit width; smeared-out dopant distribution; thin-film SOI device; Analytical models; Diffusion processes; Doping profiles; Impurities; Semiconductor process modeling; Silicon on insulator technology; Thin film devices; Transistors; Very large scale integration; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics and VLSI, 1995. TENCON '95., IEEE Region 10 International Conference on
Print_ISBN
0-7803-2624-5
Type
conf
DOI
10.1109/TENCON.1995.496432
Filename
496432
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