Title :
Verification of thermal analysis of PWBs for RAMCAD
Author :
Gore, J.P. ; diMarzo, M. ; Resch, C. ; Pech, M.
Author_Institution :
Dept. of Mech. Eng., Maryland Univ., College Park, MD, USA
Abstract :
Methods involving approximate numerical solutions of the energy equations in two dimensions were developed to allow thermal management and tradeoffs to be conducted efficiently. A validation of the approximate theoretical predictions compared favorably with the experimental data using infrared thermography. Experimental data indicate that infrared thermography provides a method of measuring the temperatures of powered PWBs (printed wiring boards). The overall difference between the measured temperature profile and the calculated temperature profile is within 10%. The discrepancies are thought to be due to uncertainties in material properties and the experimental methods
Keywords :
circuit CAD; printed circuit testing; thermal analysis; RAMCAD; approximate numerical solutions; energy equations; infrared thermography; material properties; powered PWBs; printed wiring boards; temperature profile; thermal analysis; thermal management; uncertainties; Educational institutions; Electronic packaging thermal management; Heat transfer; Temperature dependence; Thermal conductivity; Thermal force; Thermal management; Thermal management of electronics; Thermal resistance; Thermal stresses;
Conference_Titel :
Reliability and Maintainability Symposium, 1989. Proceedings., Annual
Conference_Location :
Atlanta, GA
DOI :
10.1109/ARMS.1989.49649
