Title :
Methods of metal oxide dielectric films testing
Author_Institution :
Herzen State Pedagogical Univ., St. Petersburg, Russia
Abstract :
In the bulk of the dielectric anodic film Ta2O5 (Nb2O5) and in the vicinity of the interface with tantalum (niobium), there are structural defects which create channels of increased conductivity and affect the leakage current of tantalum capacitors. The nature, concentration and electrical activity of the structural defects of an anodic film are determined by the composition and structure of the surface layer of the tantalum, the conditions of formation of the oxide layer, the material and the method of formation of the cathode material. The author presents a number of experimental techniques for detecting, in an amorphous oxide dielectric, structural defects which accelerate film destruction processes in a strong electric field and thus are potentially dangerous under prolonged thermoelectric stresses applied to capacitor structures. These techniques are based on structure-sensitive electrical phenomena in amorphous metal oxide dielectrics
Keywords :
anodised layers; dielectric loss measurement; dielectric thin films; electrolytic capacitors; electron device noise; flaw detection; leakage currents; niobium compounds; noncrystalline defects; tantalum compounds; Nb-Nb2O5; Nb2O5; Ta; Ta capacitors; Ta-Ta2O5; Ta2O5; amorphous oxide dielectric; capacitor structures; cathode material formation; dielectric anodic film; electrical activity; film destruction processes; increased conductivity channels; interface; leakage current; low frequency excess noise; metal oxide dielectric films testing; oxide layer formation; prolonged thermoelectric stresses; strong electric field; structural defects; structure-sensitive electrical phenomena; surface layer composition; Amorphous materials; Capacitors; Composite materials; Conductive films; Conductivity; Dielectric films; Dielectric materials; Leakage current; Niobium; Testing;
Conference_Titel :
Electrical Insulating Materials, 1995. International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
4-88686-047-8
DOI :
10.1109/ISEIM.1995.496566