Title :
Creepage breakdown characteristics of printed wiring board in silicone gel
Author :
Maeda, T. ; Haga, K. ; Maeda, T.
Author_Institution :
Fuji Electr. Corp. Res. & Dev. Ltd., Yokosuka, Japan
Abstract :
We measure the creepage breakdown characteristics of printed wiring boards in silicone gel and obtain an experimental equation. This equation allows us to consider separately the different factors (creepage distance, intrinsic capacity, relative permittivity, insulation layer thickness and electrode location) affecting breakdown voltage. Further, we are able to predict accurately the breakdown limit of insulation in two planes
Keywords :
capacitance; electric breakdown; epoxy insulation; insulation testing; permittivity; power electronics; printed circuit testing; silicone insulation; breakdown voltage; creepage breakdown characteristics; creepage distance; electrode location; epoxy resin substrate; insulation breakdown limit; insulation layer thickness; intrinsic capacity; power device products; printed wiring board; relative permittivity; silicone gel; Breakdown voltage; Copper; Dielectric substrates; Dielectrics and electrical insulation; Electric breakdown; Electrodes; Epoxy resins; Equations; Product design; Wiring;
Conference_Titel :
Electrical Insulating Materials, 1995. International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
4-88686-047-8
DOI :
10.1109/ISEIM.1995.496567
