Title :
Thermal stability of magnetic tunnel junctions with new amorphous ZrAl alloy films as under and capping layers
Author :
Choi, Chul-Min ; Song, Jin-Oh ; Lee, Seong-Rue
Author_Institution :
Div. of Mater. Sci. & Eng., Korea Univ., Seoul, South Korea
Abstract :
This study investigated the effects of ZrAl under layers and capping layers on the thermal stability and structural stability behavior of MTJs with ZrAl-oxide barrier at elevated temperatures. The results were compared with conventional Ta-based MTJs with Al-oxide barrier. Magnetron sputtering was used to prepare an MTJ consisting of Si/SiO2/ZrAl 2 nm(or Ta 5 nm)/NiFe 4 nm/IrMn 7.5 nm/CoFe 3 nm/ZrAl 1.6 nm(or Al)-oxidation/CoFe 3 nm/ZrAl 2 nm(or Ta 5 nm). AFM and TEM analysis showed that the ZrAl under layer improved interface uniformity, developed fine and dense grain structure, and retarded the development of texture of upper layers due to their noncrystallinity. Also, the ZrAl-oxide barrier is found to be not only a structurally stable, high-quality barrier, but is also thermally stable. TMR ratio variation were measured as a function of annealing temperatures.
Keywords :
aluminium alloys; amorphous magnetic materials; annealing; atomic force microscopy; cobalt alloys; interface structure; iridium alloys; iron alloys; magnetic thin films; manganese alloys; nickel alloys; sputter deposition; tantalum; texture; thermal stability; transmission electron microscopy; tunnelling magnetoresistance; zirconium alloys; 1.6 nm; 2 nm; 3 nm; 4 nm; 5 nm; 7.5 nm; AFM; Si-SiO2-Ta-NiFe-IrMn-CoFe-Al-O-CoFe-ZrAl; Si-SiO2-ZrAl-NiFe-IrMn-CoFe-ZrAl-O-CoFe-ZrAl; TEM; TMR; amorphous ZrAl alloy films; annealing; capping layers; grain structure; interface uniformity; magnetic tunnel junctions; magnetron sputtering; oxidation; oxide barrier; structural stability; texture; thermal stability; under layers; Amorphous magnetic materials; Amorphous materials; Magnetic films; Magnetic materials; Magnetic tunneling; Materials science and technology; Plasma temperature; Rapid thermal annealing; Thermal engineering; Thermal stability;
Conference_Titel :
Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
Print_ISBN :
0-7803-9009-1
DOI :
10.1109/INTMAG.2005.1464438