Title :
Characteristics of the Al2O3 barrier with CoFeB pinned layer in magnetic tunnel junctions
Author :
Bae, Ji Young ; Lim, Woo Chang ; Kim, Tae Wan ; Lee, Taek Dong
Author_Institution :
Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea
Abstract :
Amorphous FM electrode, CoFeB, was used in MTJs to improve the property of the insulating layer interface. The tunnel junctions with a structure of Ta(50 nm)/NiFe(8 nm)/IrMn(10 nm)/pinned layer(4 nm)/Al2O3(Al 1.1 nm)/CoFeB(3 nm)/NiFe(15 nm) were prepared in a DC magnetron sputtering system. The junctions were made by a photolithographic method and the samples were annealed from 200 °C to 340 °C. The depth profiles of the insulating barrier before and after annealing were analyzed by XPS and SIMS. MR ratio and junction resistance (RA) products of the MTJs were measured with annealing temperature. The maximum MR ratio were observed at 260 °C annealing. RA products increased up to 380 °C for CoFeB pinned junctions while it increased up to a 280 °C and decreased over this temperature in the tunnel junctions with CoFe pinned layer.
Keywords :
X-ray photoelectron spectra; aluminium compounds; amorphous magnetic materials; annealing; boron alloys; cobalt alloys; electric resistance; ferromagnetic materials; insulating materials; iridium alloys; iron alloys; manganese alloys; nickel alloys; photolithography; secondary ion mass spectra; sputter deposition; tantalum; tunnelling magnetoresistance; 1.1 nm; 10 nm; 15 nm; 200 to 340 degC; 3 nm; 380 degC; 4 nm; 50 nm; 8 nm; DC magnetron sputtering; MR ratio; MTJ; SIMS; Ta-NiFe-IrMn-Al2O3-CoFeB-NiFe; XPS; amorphous FM electrode; annealing; depth profiles; insulating barrier; insulating layer interface; junction resistance products; magnetic tunnel junctions; photolithographic method; pinned junctions; pinned layer; Amorphous magnetic materials; Amorphous materials; Annealing; Electrical resistance measurement; Electrodes; Insulation; Magnetic analysis; Magnetic tunneling; Sputtering; Temperature measurement;
Conference_Titel :
Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International
Print_ISBN :
0-7803-9009-1
DOI :
10.1109/INTMAG.2005.1464450