DocumentCode :
3540208
Title :
Biomedical implant transceiver with novel multi level LSK back telemetry and fully digital BPSK demodulation
Author :
Xu, Wangren ; Luo, Zhenying ; Sonkusale, Sameer
Author_Institution :
Nanoscale Integrated Sensors & Circuits Lab., Tufts Univ., Medford, MA
fYear :
2009
fDate :
3-5 April 2009
Firstpage :
1
Lastpage :
2
Abstract :
Low power consumption and higher data rate is desired in biomedical implant transceivers. A novel fully digital Binary Phase Shift Keying (BPSK) demodulator and a multi-level Load Shift Keying (LSK) for passive back telemetry are implemented to reduce the power consumption and increase the data rate for implant transceivers. The digital architecture allows the BPSK demodulator to consume much less power compared to prior art. We demonstrate silicon realization of the BPSK demodulator operating at 13.56 MHz with data rate as high as 800 kbits/s in a 0.5 mum CMOS process with power consumption of 2.3 mW. A multi-level Load Shift Keying (LSK) for passive back telemetry is implemented using discrete components and works by modulating the load impedance at the implant to create distinct reflections at the primary coil of the reader. The back telemetry techniques is verified through simulation and measurement results and demonstrate a 2X improvement in data rate compared to conventionPal bi-level back telemetry.
Keywords :
elemental semiconductors; prosthetics; silicon; telemedicine; CMOS process; Si; binary phase shift keying demodulator; biomedical implant transceiver; frequency 13.56 MHz; fully digital BPSK demodulation; load shift keying; novel multilevel LSK back telemetry; passive back telemetry; power 2.3 mW; power consumption; silicon; size 0.5 mum; Art; Back; Binary phase shift keying; CMOS process; Demodulation; Energy consumption; Implants; Silicon; Telemetry; Transceivers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bioengineering Conference, 2009 IEEE 35th Annual Northeast
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-4362-8
Electronic_ISBN :
978-1-4244-4364-2
Type :
conf
DOI :
10.1109/NEBC.2009.4967630
Filename :
4967630
Link To Document :
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