Title :
KFM evaluation of seebeck coefficient in thin SOI layers
Author :
Ikeda, Hinata ; Suzuki, Yuya ; Miwa, Kenichiro ; Salleh, F.
Author_Institution :
Res. Inst. of Electron., Shizuoka Univ., Hamamatsu, Japan
Abstract :
Although the introduction of nanostructures into thermoelectric materials is one of key technology for enhancement in thermoelectric conversion efficiency, a technique for characterizing the nanometer-scale materials is required. With the aim of evaluating Seebeck coefficient of nanostructured thermoelectric materials, we propose a new technique by Kelvin- probe force microscopy (KFM) which gives us local surface potential corresponding to the Fermi energy difference of a sample relative to the cantilever. Hence, thermoelectromotive force and temperature difference are obtained from the surface potentials and temperatures at the high- and low-temperature regions on the sample, which leads to evaluation of Seebeck coefficient. First of all, the Seebeck coefficients of bulk Si wafers and Si-on-insulator (SOI) layers were measured. At present, the Seebeck coefficient is evaluated to be -2.8mV/K for a SOI layer, which is larger than the value obtained by a conventional method.
Keywords :
Fermi level; Seebeck effect; elemental semiconductors; nanostructured materials; silicon; silicon-on-insulator; surface potential; Fermi energy; KFM; Kelvin-probe force microscopy; Seebeck coefficient; Si; Si-on-insulator layers; bulk Si wafers; cantilever; high-temperature region; low-temperature region; nanometer-scale materials; nanostructured thermoelectric materials; surface potential; thermoelectric conversion efficiency; thermoelectromotive force; thin SOI layers; Force; Microscopy; Nanostructured materials; Semiconductor device measurement; Silicon; Temperature measurement; Kelvin-probe force miceoscopy; Seebeck coefficient; nanostructue; thermoelectric material;
Conference_Titel :
QiR (Quality in Research), 2013 International Conference on
Conference_Location :
Yogyakarta
Print_ISBN :
978-1-4673-5784-5
DOI :
10.1109/QiR.2013.6632531