• DocumentCode
    3541183
  • Title

    KFM evaluation of seebeck coefficient in thin SOI layers

  • Author

    Ikeda, Hinata ; Suzuki, Yuya ; Miwa, Kenichiro ; Salleh, F.

  • Author_Institution
    Res. Inst. of Electron., Shizuoka Univ., Hamamatsu, Japan
  • fYear
    2013
  • fDate
    25-28 June 2013
  • Firstpage
    35
  • Lastpage
    38
  • Abstract
    Although the introduction of nanostructures into thermoelectric materials is one of key technology for enhancement in thermoelectric conversion efficiency, a technique for characterizing the nanometer-scale materials is required. With the aim of evaluating Seebeck coefficient of nanostructured thermoelectric materials, we propose a new technique by Kelvin- probe force microscopy (KFM) which gives us local surface potential corresponding to the Fermi energy difference of a sample relative to the cantilever. Hence, thermoelectromotive force and temperature difference are obtained from the surface potentials and temperatures at the high- and low-temperature regions on the sample, which leads to evaluation of Seebeck coefficient. First of all, the Seebeck coefficients of bulk Si wafers and Si-on-insulator (SOI) layers were measured. At present, the Seebeck coefficient is evaluated to be -2.8mV/K for a SOI layer, which is larger than the value obtained by a conventional method.
  • Keywords
    Fermi level; Seebeck effect; elemental semiconductors; nanostructured materials; silicon; silicon-on-insulator; surface potential; Fermi energy; KFM; Kelvin-probe force microscopy; Seebeck coefficient; Si; Si-on-insulator layers; bulk Si wafers; cantilever; high-temperature region; low-temperature region; nanometer-scale materials; nanostructured thermoelectric materials; surface potential; thermoelectric conversion efficiency; thermoelectromotive force; thin SOI layers; Force; Microscopy; Nanostructured materials; Semiconductor device measurement; Silicon; Temperature measurement; Kelvin-probe force miceoscopy; Seebeck coefficient; nanostructue; thermoelectric material;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    QiR (Quality in Research), 2013 International Conference on
  • Conference_Location
    Yogyakarta
  • Print_ISBN
    978-1-4673-5784-5
  • Type

    conf

  • DOI
    10.1109/QiR.2013.6632531
  • Filename
    6632531