DocumentCode
3541202
Title
Variation of Seebeck coefficient in ultrathin si layer by tuning its Fermi energy
Author
Salleh, F. ; Suzuki, Yuya ; Miwa, Kenichiro ; Ikeda, Hinata
Author_Institution
Res. Inst. of Electron., Shizuoka Univ., Hamamatsu, Japan
fYear
2013
fDate
25-28 June 2013
Firstpage
47
Lastpage
50
Abstract
We have varied the Seebeck coefficient of n-type ultrathin Si-on-insulator (SOI) layer by tuning the Fermi energy. The Fermi energy was tuned by doping P atoms into the SOI layer and by injecting carriers by applying an external bias to the SOI surface with respect to the p-Si substrate. It was found that the Seebeck coefficient decreases with increasing the impurity concentration, with a peak around 1× 1020 cm-3From the calculated density-of-states (DOS), it is considered that the peak in Seebeck coefficient is likely to be due to the formation of impurity band near the conduction-band edge, which will demolish the sharp features in low-dimensional DOS. On the other hand, the Seebeck coefficient is found to increase with increasing the external bias which is in agreement with the variation of carrier concentration in the SOI layer under external bias and it is found that the Fermi energy can be controlled without the influences of impurity band.
Keywords
Fermi level; Seebeck effect; carrier density; conduction bands; doping profiles; electronic density of states; elemental semiconductors; impurity states; nanostructured materials; phosphorus; semiconductor doping; silicon-on-insulator; SOI; Si; Si:P; carrier concentration; conduction-band edge; density-of-states; external bias; fermi energy; impurity band; impurity concentration; n-type ultrathin Si-on-insulator layer; nanostructure; seebeck coefficient; silicon substrate; Doping; Impurities; Silicon; Silicon-on-insulator; Substrates; Temperature measurement; Seebeck coefficient; Si on insulator; Thermoelectric material; nanostructure; thermopile infrared photodetector;
fLanguage
English
Publisher
ieee
Conference_Titel
QiR (Quality in Research), 2013 International Conference on
Conference_Location
Yogyakarta
Print_ISBN
978-1-4673-5784-5
Type
conf
DOI
10.1109/QiR.2013.6632534
Filename
6632534
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