Title :
Microwave flip chip and BGA technology
Author_Institution :
Raytheon Electron. Corp., Dallas, TX, USA
Abstract :
Topics discussed in this paper are flip chip and BGA packaging and related assembly issues important in the design of microwave power amplifier and integrated transceiver MMICs. Environmental stress, thermal management, electrical performance, and inspection issues associated with flip chip and ball-grid array packaging will be discussed. The selection of solders, insulating substrates and underfill, will be presented with supporting data for various materials and geometries.
Keywords :
MMIC power amplifiers; ball grid arrays; encapsulation; flip-chip devices; inspection; microassembling; soldering; thermal management (packaging); transceivers; BGA technology; MMICs; assembly issues; electrical performance; environmental stress; flip chip technology; inspection; insulating substrates; integrated transceiver; microwave power amplifier; solders; thermal management; underfill; Assembly; Flip chip; MMICs; Microwave amplifiers; Microwave technology; Packaging; Power amplifiers; Thermal management; Thermal stresses; Transceivers;
Conference_Titel :
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-5687-X
DOI :
10.1109/MWSYM.2000.863282
