DocumentCode
3541464
Title
Case study of interconnect analysis for standing wave oscillator design
Author
Shen, Meigen ; Zheng, Li-Rong ; Tenhunen, Hannu ; Tjukanoff, Esa ; Isoaho, Jouni
Author_Institution
Lab. of Electron. & Comput. Syst., R. Inst. of Technol., Kista, Sweden
fYear
2005
fDate
23-26 May 2005
Firstpage
456
Abstract
As a result of continuous downscaling CMOS technology, on-chip interconnects play a critical role in high-speed circuit design. In this paper, a geometry based accurate interconnect circuit model is extracted for high-speed circuit design and analysis. This is demonstrated through a 10 GHz standing wave oscillator (SWO) for global clock distribution. The results show that the skew of the clock is well controlled (about 1ps) while the clock frequency variation is about 20% because power/ground return paths exist in different metal layers. Hence, for high-speed circuits, the interconnect parameters should be predictable according to its geometry in order to avoid design iterations and speed time-to-market. Meanwhile, robust circuit architectures should be adopted for tolerating the parameter variations of interconnects.
Keywords
CMOS integrated circuits; MMIC oscillators; integrated circuit interconnections; integrated circuit modelling; 10 GHz; CMOS SWO; clock frequency variation; clock skew; geometry based interconnect circuit model; global clock distribution oscillator; high-speed circuits; interconnect circuit model; metal layer power/ground return paths; on-chip interconnect analysis; parameter variation tolerance; standing wave oscillator; CMOS technology; Circuit analysis; Circuit synthesis; Clocks; Frequency; Geometry; Integrated circuit interconnections; Oscillators; Semiconductor device modeling; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2005. ISCAS 2005. IEEE International Symposium on
Print_ISBN
0-7803-8834-8
Type
conf
DOI
10.1109/ISCAS.2005.1464623
Filename
1464623
Link To Document