Title :
Software system for semiconductor devices, monolith and hybrid IC´s thermal analysis
Author :
Anc, K. O Petrosj ; Kharitonov, I.A. ; Rybov, N.I. ; Maltcev, P.P.
Author_Institution :
Moscow Univ. of Electron. & Math., Russia
Abstract :
A three level software system for thermal analysis of semiconductor devices, one-chip monolith IC´s, multi-chip modules (MCM) and hybrid IC´s is presented. For each design level the 3D temperature simulators are described to analyze the steady state and transient thermal behavior and connect the design results with the device and/or IC layout and packaging constructions. Practical examples are discussed illustrating the possibilities of developed techniques and software tools
Keywords :
circuit analysis computing; circuit layout CAD; hybrid integrated circuits; integrated circuit layout; integrated circuit modelling; monolithic integrated circuits; multichip modules; temperature distribution; thermal analysis; 3D temperature simulators; hybrid ICs thermal analysis; monolith thermal analysis; multi-chip modules; packaging constructions; semiconductor device thermal analysis; software system; steady state thermal behavior; transient thermal behavior; Analytical models; Hybrid integrated circuits; Integrated circuit layout; Integrated circuit packaging; Monolithic integrated circuits; Semiconductor devices; Software systems; Steady-state; Temperature; Transient analysis;
Conference_Titel :
Design Automation Conference, 1995, with EURO-VHDL, Proceedings EURO-DAC '95., European
Conference_Location :
Brighton
Print_ISBN :
0-8186-7156-4
DOI :
10.1109/EURDAC.1995.527430
