Title :
Multi-layer spiral inductors in a high-precision, fully-planar MCM-D process
Author :
Gouker, M. ; Konistis, K. ; Knecht, J. ; Kushner, L. ; Travis, L.
Author_Institution :
Lincoln Lab., MIT, Lexington, MA, USA
Abstract :
The precision MCM process described in this paper has several performance enhancing features not found in other reported MCM processes. The process enables the fabrication of inductors with orders of magnitude greater inductance than other packaging techniques for the same area on the MCM.
Keywords :
MMIC; inductance; inductors; integrated circuit packaging; multichip modules; area; fully-planar MCM-D process; inductance; inductors; multi-layer spiral inductors; packaging techniques; precision MCM process; Capacitors; Circuit testing; Dielectrics; Fabrication; Inductors; Integrated circuit technology; Laboratories; Resistors; Silicon compounds; Spirals;
Conference_Titel :
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-5687-X
DOI :
10.1109/MWSYM.2000.863538
