DocumentCode :
3543551
Title :
Soft sensor modeling of moisture content in drying process based on LSSVM
Author :
Zhang, Dongyan ; Cao, Jun ; Sun, Liping
Author_Institution :
Dept. of Electromech. Eng., Northeast Forestry Univ., Harbin, China
fYear :
2009
fDate :
16-19 Aug. 2009
Abstract :
Least Squares Support Vector Machines(LSSVM) regression principle and measure methods of moisture content during wood drying were introduced. Wood moisture content is a key parameter for regulating and controlling wood drying proces. In this paper soft sensor model based on LSSVM was established for the weakness of wood moisture content measurement in drying process, and parameters selection adopted improved exhaust algorithm. The simulation results of Fraxinus mandshurica and Xylosma racemosum showed that the LSSVM soft sensor model had well robustness and generalization ability, and could predict wood moisture content measurement in drying process accurately, which offered an effective approach for measuring the parameters in the complicated and nonlinear process of wood drying.
Keywords :
drying; least squares approximations; production engineering computing; regression analysis; support vector machines; wood processing; Fraxinus mandshurica; LSSVM regression principle; Xylosma racemosum; drying process; least squares support vector machines; parameters selection; soft sensor modeling; wood drying; wood moisture content; Electrical resistance measurement; Electromagnetic measurements; Electromechanical sensors; Humidity; Moisture control; Moisture measurement; Predictive models; Robustness; Support vector machines; Temperature sensors; Least Squares Support Vector Machines(LSSVM); Modeling; Soft Sensor; Wood Moisture Content;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Measurement & Instruments, 2009. ICEMI '09. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-3863-1
Electronic_ISBN :
978-1-4244-3864-8
Type :
conf
DOI :
10.1109/ICEMI.2009.5274395
Filename :
5274395
Link To Document :
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