• DocumentCode
    3543821
  • Title

    An innovative heat harvesting technology (HEATec) for above-Seebeck performance

  • Author

    Puscasu, O. ; Monfray, Stephane ; Savelli, G. ; Maitre, C. ; Pemeant, J.P. ; Coronel, Pedro ; Domanski, Krzysztof ; Grabiec, Piotr ; Ancey, P. ; Cottinet, P.J. ; Guyomar, Daniel ; Bottarel, Valeria ; Ricotti, Giulio ; Bimbaud, I. ; Boeuf, F. ; Gaillard, F

  • Author_Institution
    STMicroelectron. (Crolles 2) SAS, Crolles, France
  • fYear
    2012
  • fDate
    10-13 Dec. 2012
  • Abstract
    An innovative approach to heat energy harvesting (HEATec) is proposed in this paper. It consists of a two-step conversion of heat into electricity. The first step is a thermo-mechanical conversion by a bimetal and the second is an electromechanical conversion by a piezoelectric. The first developed prototypes show natural thermal resistance matching between their body and the interface with ambient air, and therefore do not need a heat sink in order to work. The available mechanical power (2.7 mW/cm2 measured in practice for a single bimetal, and extendable to theoretical 27 mW/cm2 for 100 bimetals occupying the same surface) that can be converted into electricity may lead to a superior performance compared to the best commercial Seebeck devices. Analytical scaling laws for our technology have been established and show power density gain equal to the scaling factor, making it LSI integration favorable.
  • Keywords
    Seebeck effect; energy harvesting; innovation management; thermal resistance; HEATec; LSI integration; above-Seebeck performance; ambient air; commercial Seebeck devices; electromechanical conversion; innovative heat harvesting technology; mechanical power; piezoelectric; step conversion; thermal resistance matching; thermo-mechanical conversion; Heat sinks; Layout; Prototypes; Resistance heating; Temperature measurement; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2012 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0163-1918
  • Print_ISBN
    978-1-4673-4872-0
  • Electronic_ISBN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.2012.6479031
  • Filename
    6479031