DocumentCode
3543821
Title
An innovative heat harvesting technology (HEATec) for above-Seebeck performance
Author
Puscasu, O. ; Monfray, Stephane ; Savelli, G. ; Maitre, C. ; Pemeant, J.P. ; Coronel, Pedro ; Domanski, Krzysztof ; Grabiec, Piotr ; Ancey, P. ; Cottinet, P.J. ; Guyomar, Daniel ; Bottarel, Valeria ; Ricotti, Giulio ; Bimbaud, I. ; Boeuf, F. ; Gaillard, F
Author_Institution
STMicroelectron. (Crolles 2) SAS, Crolles, France
fYear
2012
fDate
10-13 Dec. 2012
Abstract
An innovative approach to heat energy harvesting (HEATec) is proposed in this paper. It consists of a two-step conversion of heat into electricity. The first step is a thermo-mechanical conversion by a bimetal and the second is an electromechanical conversion by a piezoelectric. The first developed prototypes show natural thermal resistance matching between their body and the interface with ambient air, and therefore do not need a heat sink in order to work. The available mechanical power (2.7 mW/cm2 measured in practice for a single bimetal, and extendable to theoretical 27 mW/cm2 for 100 bimetals occupying the same surface) that can be converted into electricity may lead to a superior performance compared to the best commercial Seebeck devices. Analytical scaling laws for our technology have been established and show power density gain equal to the scaling factor, making it LSI integration favorable.
Keywords
Seebeck effect; energy harvesting; innovation management; thermal resistance; HEATec; LSI integration; above-Seebeck performance; ambient air; commercial Seebeck devices; electromechanical conversion; innovative heat harvesting technology; mechanical power; piezoelectric; step conversion; thermal resistance matching; thermo-mechanical conversion; Heat sinks; Layout; Prototypes; Resistance heating; Temperature measurement; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2012 IEEE International
Conference_Location
San Francisco, CA
ISSN
0163-1918
Print_ISBN
978-1-4673-4872-0
Electronic_ISBN
0163-1918
Type
conf
DOI
10.1109/IEDM.2012.6479031
Filename
6479031
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