DocumentCode :
3543841
Title :
1-V rail-to-rail constant trans-conductance operation amplifier
Author :
Liang, Deng ; Hong-Hui, Deng ; Yong-Sheng, Yin ; Guo-Min, Zhang
Author_Institution :
Inst. of VLSI Design, Hefei Univ. of Technol., Hefei, China
fYear :
2009
fDate :
16-19 Aug. 2009
Abstract :
A 1-V rail-to-rail operational amplifier with a constant gain is presented in this paper. A feedback structure which provides the availability of using two differential pairs is employed to maintain the trans-conductance constant in the input stage. Moreover, the feedback-control trans-conductance circuit enhances the robustness of the operational amplifier since it needn´t consider the matching of differential pairs, and it also widens the common input voltage which makes the power supply voltage to be at 1 V possible. Considering the low supply voltage and enough capability to drive large loads, a feedback class-AB structure is available in the output stage. With the supply voltage at 1 V(loaded by 5 pF and 10 KOmega), the operational amplifier is simulated by HSPICE in the standard 0.18 mum CMOS process, achieving a low-frequency voltage gain of 76 dB, a unit frequency bandwidth of 5.2 MHz and phase margin of 63deg, with a power dissipation of only 95 uW.
Keywords :
CMOS integrated circuits; SPICE; feedback amplifiers; operational amplifiers; CMOS process; HSPICE simulation; capacitance 5 pF; constant gain; differential pair matching; feedback class-AB structure; feedback-control transconductance circuit; rail-to-rail operational amplifier; resistance 10 kohm; size 0.18 mum; transconductance constant; voltage 1 V; Differential amplifiers; Feedback circuits; Low voltage; Operational amplifiers; Output feedback; Power amplifiers; Power supplies; Rail to rail amplifiers; Rail to rail operation; Robustness; constant trans-conductance; feedback control class-AB output stage; low-voltage low-power; operational amplifier;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Measurement & Instruments, 2009. ICEMI '09. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-3863-1
Electronic_ISBN :
978-1-4244-3864-8
Type :
conf
DOI :
10.1109/ICEMI.2009.5274430
Filename :
5274430
Link To Document :
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