High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration

Author

Liu, C.C. ; Shuo-Mao Chen ; Feng-Wei Kuo ; Huan-Neng Chen ; En-Hsiang Yeh ; Cheng-Chieh Hsieh ; Li-Hsien Huang ; Ming-Yen Chiu ; Yeh, Jen-Hao ; Tsung-Shu Lin ; Tzu-Jin Yeh ; Shang-Yun Hou ; Jui-Pin Hung ; Jing-Cheng Lin ; Chewn-Pu Jou ; Chuei-Tang Wang ;

Author_Institution

Taiwan Semicond. Manuf. Co., Ltd., Hsinchu, Taiwan

fYear

2012

fDate

10-13 Dec. 2012

Abstract

Integrated fan-out wafer-level packaging (InFO-WLP) technology with state-of-the-art inductors (quality factor of 42 and self-resonance frequency of 16 GHz) has been demonstrated for heterogeneous integration of digital and radio frequency (RF) systems. InFO-WLP promises superior form factor, pin count, and thermal performance to existing flip-chip ball grid array (FC-BGA) packages. In addition, InFO-WLP´s high Q inductors can enhance electrical performance and lower power consumption in RF circuit applications.

Keywords

Q-factor; ball grid arrays; flip-chip devices; inductors; thermal analysis; wafer level packaging; FC-BGA packages; InFO-WLP high Q inductors; InFO-WLP technology; RF circuit applications; RF systems; digital systems; flip-chip ball grid array packages; frequency 16 GHz; high-performance integrated fan-out wafer level packaging; power consumption; quality factor; radiofrequency system; thermal performance; Compounds; Inductors; Noise; Q-factor; Radio frequency; Silicon; System-on-chip;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting (IEDM), 2012 IEEE International

Conference_Location

San Francisco, CA

ISSN

0163-1918

Print_ISBN

978-1-4673-4872-0

Electronic_ISBN

0163-1918

Type

conf

DOI

10.1109/IEDM.2012.6479039

Filename

6479039