DocumentCode
3543908
Title
Analog and RF circuits design and future devices interaction
Author
Matsuzawa, Akira
Author_Institution
Dept. of Phys. Electron., Tokyo Inst. of Technol., Tokyo, Japan
fYear
2012
fDate
10-13 Dec. 2012
Abstract
This paper reviews and discusses the recent progress of analog and RF circuits design and the future devices interaction, focusing on the millimeter wave RF circuits and ADCs. With the scaling of CMOS technology, fT and fmax are increased. Using an advanced CMOS process and techniques such as the negative capacitance, the gain flattening, the accurate impedance matching using transmission lines, and the injection locking, a 60 GHz CMOS transceiver is realized. It attains 16 Gbps data transmission with the 16 QAM method. A dynamic comparator using a dynamic pre-amplifier with capacitive digital offset voltage compensation realizes a small mismatch voltage, low noise, low power, and low voltage operation without any static current. Flash ADCs and SAR ADCs using dynamic comparators have progressed. The interpolation method can ease the gain requirement for OpAmp in pipelined ADCs. The interconnection structure should be considered to realize low loss transmission lines and high density and large capacitance ratio MOM capacitors.
Keywords
analogue-digital conversion; comparators (circuits); compensation; field effect MIMIC; impedance matching; low-power electronics; millimetre wave amplifiers; operational amplifiers; preamplifiers; quadrature amplitude modulation; radio transceivers; transmission lines; 16-QAM method; CMOS technology; CMOS transceiver; RF circuit design; SAR ADC; advanced CMOS process; analog circuit design; bit rate 16 Gbit/s; capacitive digital offset voltage compensation; dynamic comparator; dynamic preamplifier; flash ADC; frequency 60 GHz; gain flattening; impedance matching; injection locking; interconnection structure; large capacitance ratio MOM capacitors; low loss transmission lines; millimeter wave RF circuits; negative capacitance; opamp; pipelined ADC; CMOS integrated circuits; Capacitance; Gain; Phase noise; Quadrature amplitude modulation; Radio frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2012 IEEE International
Conference_Location
San Francisco, CA
ISSN
0163-1918
Print_ISBN
978-1-4673-4872-0
Electronic_ISBN
0163-1918
Type
conf
DOI
10.1109/IEDM.2012.6479041
Filename
6479041
Link To Document