• DocumentCode
    3543956
  • Title

    A three-level toggle-avoid bus signaling scheme

  • Author

    Zhang, Yan ; Blalock, Travis ; Stan, Mircea R.

  • Author_Institution
    ECE Dept., Virginia Univ., Charlottesville, VA, USA
  • fYear
    2005
  • fDate
    23-26 May 2005
  • Firstpage
    1843
  • Abstract
    Coupling capacitances between bus lines are dominant in deep-submicron technologies, as a result, both power dissipation and worst-case delay are increased due to coupling transitions. Based on the observation that the toggling sequences 01->10 or 10->01 between two adjacent lines result in four times more coupling energy than other coupling events, we propose a toggle-avoid signaling scheme. By applying a three-level signaling on buses with a choice for representing logic "1", toggling events are reduced with no extra bus lines. We achieve 32% total power savings and 40% worst-case delay reduction with a small power overhead.
  • Keywords
    capacitance; integrated circuit interconnections; power consumption; system-on-chip; bus lines; bus signaling scheme; coupling capacitances; coupling transitions; deep-submicron technologies; delay reduction; power dissipation; power savings; three-level toggle-avoid scheme; worst-case delay; Capacitance; Delay; Encoding; Energy consumption; Energy dissipation; Logic; Power dissipation; System-on-a-chip; Voltage; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2005. ISCAS 2005. IEEE International Symposium on
  • Print_ISBN
    0-7803-8834-8
  • Type

    conf

  • DOI
    10.1109/ISCAS.2005.1464969
  • Filename
    1464969