DocumentCode :
3544158
Title :
High on/off-ratio P-type oxide-based transistors integrated onto Cu-interconnects for on-chip high/low voltage-bridging BEOL-CMOS I/Os
Author :
Sunamura, H. ; Kaneko, Kunihiko ; Furutake, N. ; Saito, Sakuyoshi ; Narihiro, M. ; Ikarashi, N. ; Hane, M. ; Hayashi, Yasuhiro
Author_Institution :
LSI Res. Lab., Renesas Electron. Corp., Sagamihara, Japan
fYear :
2012
fDate :
10-13 Dec. 2012
Abstract :
A new P-type amorphous SnO thin-film transistor with high Ion/Ioff ratio of >104 is developed, for the first time, as a component to complement N-type IGZO transistors for on-chip voltage-bridging BEOL-CMOS I/Os on conventional Si-LSI Cu-interconnects (Fig. 1). Dedicated low-temperature (<;400°C) oxide-semiconductor processes are implemented to overcome several integration challenges (Fig. 2) with only one-mask addition using standard BEOL process tools (Fig. 3). We demonstrate high Ion/Ioff ratio of >104 and high-Vd capability (|Vbd|>40V) with gate-to-drain offset structure, showing superior properties over the previously reported values (Table 1). The SnO transistor is suited for the BEOL-CMOS I/O, which gives standard LSIs a special add-on function to control high voltage signals directly in smart society applications.
Keywords :
CMOS integrated circuits; amorphous semiconductors; copper; integrated circuit interconnections; large scale integration; thin film transistors; tin compounds; Cu; LSI interconnection; SnO; dedicated low-temperature oxide-semiconductor process; gate-to-drain offset structure; high on-off-ratio p-type oxide-based transistors; high voltage signal control; n-type IGZO transistors; on-chip high-low voltage-bridging BEOL-CMOS I/O; p-type amorphous thin-film transistor; standard BEOL process tools; Dielectrics; Logic gates; Materials; Ohmic contacts; Process control; Standards; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2012 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0163-1918
Print_ISBN :
978-1-4673-4872-0
Electronic_ISBN :
0163-1918
Type :
conf
DOI :
10.1109/IEDM.2012.6479070
Filename :
6479070
Link To Document :
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