• DocumentCode
    3544316
  • Title

    Simulation of low-pressure capacitively coupled plasmas using a parallelized particle-in-cell simulation and a direct simulation of Monte Carlo for neutrals

  • Author

    Jin Seok Kim ; In Cheol Song ; Ho-Jun Lee ; Hae June Lee

  • Author_Institution
    Dept. of Electr. Eng., Pusan Nat. Univ., Busan, South Korea
  • fYear
    2013
  • fDate
    16-21 June 2013
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Summary form only given. There are increasing demands for nano-scale plasma processing such as nano-particle generation, oxide etching, and high quality thin film deposition as the microelectronics industry grows rapidly. Under very low-pressure condition (up to a few mTorr), it is difficult to generate and maintain plasmas, and therefore it is important to understand the properties of neutral gas flow together. In this study, a two-dimensional axisymmetric particle-in-cell (PIC) simulation parallelized with graphic processing units (GPUs) was utilized for the investigation of discharge characteristics of a capacitively coupled plasma (CCP) device. Direct simulation Monte-Carlo (DSMC) method was used for the calculation of neutral distribution instead of fluid model for low-pressure regime. In order to increase plasma generation under very low-pressure condition, several methods can be applied such as external magnetic field, electron beam injection [1], and resonance heating [2], of which effects are investigated in this study.
  • Keywords
    Monte Carlo methods; graphics processing units; integrated circuits; parallel algorithms; physics computing; plasma beam injection heating; plasma deposition; plasma magnetohydrodynamics; plasma radiofrequency heating; plasma simulation; sputter etching; capacitively coupled plasma device; direct simulation Monte-Carlo method; discharge characteristics; electron beam injection heating; external magnetic field; fluid model; graphic processing units; high quality thin film deposition; low-pressure capacitively coupled plasma simulation; low-pressure regime; microelectronics; nanoparticle generation; nanoscale plasma processing; neutral distribution; neutral gas flow; oxide etching; parallelized particle-in-cell simulation; plasma generation; resonance heating; two-dimensional axisymmetric particle-in-cell simulation; Discharges (electric); Educational institutions; Electrical engineering; Electron beams; Heating; Monte Carlo methods; Plasmas;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science (ICOPS), 2013 Abstracts IEEE International Conference on
  • Conference_Location
    San Francisco, CA
  • ISSN
    0730-9244
  • Type

    conf

  • DOI
    10.1109/PLASMA.2013.6633183
  • Filename
    6633183