• DocumentCode
    3544322
  • Title

    An external circuit model for 3D electromagnetic particle-in-cell simulations

  • Author

    Lin, M.C. ; Zhou, C.D. ; Smithe, David N.

  • Author_Institution
    Tech-X Corp., Boulder, CO, USA
  • fYear
    2013
  • fDate
    16-21 June 2013
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Summary form only given. In this work, an algorithm for coupling external circuit elements to electromagnetic (EM) particle-in-cell (PIC) simulations is developed. The circuit equation including an external voltage or current source, resistance, inductance, capacitance, and a dynamic load is solved simultaneously with the EM PIC updaters through an instant measured voltage across the system to obtain the supplied current for feeding into the system. This external circuit model has been demonstrated and implemented in a 3D conformal finite-difference time-domain PIC code, Vorpal.
  • Keywords
    capacitance; computational electromagnetics; electric resistance; finite difference time-domain analysis; inductance; plasma simulation; plasma transport processes; 3D conformal finite-difference time-domain PIC code; 3D electromagnetic particle-in-cell simulations; EM PIC updaters; Vorpal code; capacitance; circuit equation; dynamic load; external circuit elements; external circuit model; external current source; external voltage source; inductance; resistance; Electromagnetics; Integrated circuit modeling; Load modeling; Mathematical model; Solid modeling; Three-dimensional displays; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science (ICOPS), 2013 Abstracts IEEE International Conference on
  • Conference_Location
    San Francisco, CA
  • ISSN
    0730-9244
  • Type

    conf

  • DOI
    10.1109/PLASMA.2013.6633184
  • Filename
    6633184