DocumentCode :
3544322
Title :
An external circuit model for 3D electromagnetic particle-in-cell simulations
Author :
Lin, M.C. ; Zhou, C.D. ; Smithe, David N.
Author_Institution :
Tech-X Corp., Boulder, CO, USA
fYear :
2013
fDate :
16-21 June 2013
Firstpage :
1
Lastpage :
1
Abstract :
Summary form only given. In this work, an algorithm for coupling external circuit elements to electromagnetic (EM) particle-in-cell (PIC) simulations is developed. The circuit equation including an external voltage or current source, resistance, inductance, capacitance, and a dynamic load is solved simultaneously with the EM PIC updaters through an instant measured voltage across the system to obtain the supplied current for feeding into the system. This external circuit model has been demonstrated and implemented in a 3D conformal finite-difference time-domain PIC code, Vorpal.
Keywords :
capacitance; computational electromagnetics; electric resistance; finite difference time-domain analysis; inductance; plasma simulation; plasma transport processes; 3D conformal finite-difference time-domain PIC code; 3D electromagnetic particle-in-cell simulations; EM PIC updaters; Vorpal code; capacitance; circuit equation; dynamic load; external circuit elements; external circuit model; external current source; external voltage source; inductance; resistance; Electromagnetics; Integrated circuit modeling; Load modeling; Mathematical model; Solid modeling; Three-dimensional displays; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science (ICOPS), 2013 Abstracts IEEE International Conference on
Conference_Location :
San Francisco, CA
ISSN :
0730-9244
Type :
conf
DOI :
10.1109/PLASMA.2013.6633184
Filename :
6633184
Link To Document :
بازگشت