DocumentCode :
3544462
Title :
In situ spectral ellipsometry for real-time diagnostics and control in microelectronics manufacturing
Author :
Duncan, W.M.
Author_Institution :
Components & Mater. Res. Center, Texas Instrum. Inc., Dallas, TX, USA
fYear :
1998
fDate :
3-8 May 1998
Firstpage :
348
Abstract :
Summary form only given. Real-time sensors capable of process and wafer state monitoring are key enablers in monitoring and control of microelectronic manufacturing processes. In single wafer manufacturing environments, different device and process flows are interspersed through common chambers; hence, each wafer must serve as its own pilot. Also increasing the need for real time monitoring is the progression to smaller feature sizes and thinner limiting film thicknesses thus requiring tighter control of wafer tolerances. In this work we will describe the development and implementation of a high speed spectral ellipsometer sensor capable of real-time in situ wafer state diagnostics and control during deposition and etching of microelectronic materials.
Keywords :
ellipsometry; integrated circuit manufacture; integrated circuit testing; measurement errors; monitoring; optical sensors; feature sizes; highspeed spectral ellipsometer sensor; in situ spectral ellipsometry; limiting film thicknesses; microelectronic manufacturing processes; microelectronic material etching; microelectronic materials deposition; microelectronics manufacturing; microelectronics manufacturing control; monitoring; process flows; real-time diagnostics; real-time in situ wafer state diagnostics; real-time sensors; single wafer manufacturing environments; wafer state monitoring; wafer tolerances; Ellipsometry; Manufacturing; Metrology; Microelectronics; Monitoring; Optical films; Optical scattering; Optical sensors; Radar measurements; Scanning electron microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
1-55752-339-0
Type :
conf
DOI :
10.1109/CLEO.1998.676278
Filename :
676278
Link To Document :
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