DocumentCode :
3544503
Title :
Alignment-free injection-molded plastic modules for free-space optical interconnection
Author :
Kim, Tae Jin ; Neilson, David T. ; Schenfeld, E.
Author_Institution :
NEC Res. Inst., Princeton, NJ, USA
fYear :
1998
fDate :
3-8 May 1998
Firstpage :
350
Lastpage :
351
Abstract :
Summary form only given. We propose a solution to this packaging and alignment problem by using low-cost, injection-molded plastic optical multichip modules (OMCM). This OMCM is a complete hybrid integration of optical, optomechanical, optoelectronic, and electronic components in a self-aligned single platform. The module integrates microlenses, beam-splitting surfaces, and module-to-module connectors and spacers and has room for integrating the optoelectronics devices directly on it.
Keywords :
integrated optoelectronics; lenses; modules; optical beam splitters; optical interconnections; plastics; IC packaging; alignment problem; alignment-free injection-molded plastic modules; beam-splitting surfaces; free-space optical interconnection; low-cost injection-molded plastic optical multichip modules; microlenses; module-to-module connectors; optoelectronics devices; self-aligned single platform; Connectors; Electronic components; Electronics packaging; Integrated optics; Lenses; Microoptics; Multichip modules; Optical devices; Optoelectronic devices; Plastic packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
1-55752-339-0
Type :
conf
DOI :
10.1109/CLEO.1998.676284
Filename :
676284
Link To Document :
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