• DocumentCode
    3544519
  • Title

    Optoelectronic interconnections for high-performance systems

  • Author

    Towe, E.

  • Author_Institution
    Defense Adv. Res. Projects Agency, Arlington, VA, USA
  • fYear
    1998
  • fDate
    3-8 May 1998
  • Firstpage
    352
  • Abstract
    Summary form only given. This paper discusses the need for optoelectronic interconnections at the length scale of millimeters to centimeters; we will discuss some of the special image processing problems that drive this need, and a current DARPA program aimed at implementing optical interconnections between chips or MCMs.
  • Keywords
    image processing; multichip modules; optical interconnections; MCMs; chips; current DARPA program; high-performance systems; optical interconnections; optoelectronic interconnections; special image processing problems; Adaptive optics; Bandwidth; Hardware; Integrated circuit interconnections; Optical interconnections; Optical sensors; Sensor arrays; Silicon; Vertical cavity surface emitting lasers; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    1-55752-339-0
  • Type

    conf

  • DOI
    10.1109/CLEO.1998.676286
  • Filename
    676286