Title :
Optoelectronic interconnections for high-performance systems
Author_Institution :
Defense Adv. Res. Projects Agency, Arlington, VA, USA
Abstract :
Summary form only given. This paper discusses the need for optoelectronic interconnections at the length scale of millimeters to centimeters; we will discuss some of the special image processing problems that drive this need, and a current DARPA program aimed at implementing optical interconnections between chips or MCMs.
Keywords :
image processing; multichip modules; optical interconnections; MCMs; chips; current DARPA program; high-performance systems; optical interconnections; optoelectronic interconnections; special image processing problems; Adaptive optics; Bandwidth; Hardware; Integrated circuit interconnections; Optical interconnections; Optical sensors; Sensor arrays; Silicon; Vertical cavity surface emitting lasers; Wire;
Conference_Titel :
Lasers and Electro-Optics, 1998. CLEO 98. Technical Digest. Summaries of papers presented at the Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
1-55752-339-0
DOI :
10.1109/CLEO.1998.676286
