Impact on signal integrity of differential pair routing over split plane and voids

Author

Mukhtar, A.O. ; Jalaluddin, Y.A. ; Kong, Jackson ; Aftanasar, M.S.

Author_Institution

Sch. of Electr. & Electron. Eng., Univ. Sains Malaysia, Nibong Tebal, Malaysia

fYear

2012

fDate

10-11 July 2012

Firstpage

140

Lastpage

144

Abstract

Differential pair routing on Printed Circuit Board (PCB) level is widely used as interconnection due to its excellent performance in signal integrity. However, differential pair routing is not perfectly immune to the impact of routing discontinuities. This paper analyzes the impact of differential pair microstrip with routing discontinuities by using industrial configuration standard. There are two types of routing discontinuities that are discussed in this paper. They are routing over split plane and routing over void. The results of this research are based on Ansoft HFSS fullwave 3D modeling and analysis simulation. The simulation results consist of three parts which are S-parameter, TDR and full channel transient analysis. The transmission line cross-sectional is based on SATA3 industrial geometry design. From this research, the results show that the impact of differential pair routing with routing discontinuities is significant, in view of signal integrity performance degradation.

Keywords

S-parameters; network routing; printed circuit design; printed circuit interconnections; transient analysis; Ansoft HFSS fullwave 3D modeling-analysis simulation; PCB level; S-parameter; SATA3 industrial geometry design; TDR; differential pair microstrip; differential pair routing; full channel transient analysis; industrial configuration standard; interconnection; printed circuit board level; routing discontinuities; routing-over-split plane; routing-over-void; signal integrity; transmission line cross-sectional; Analytical models; Atmospheric modeling; Impedance; Integrated circuit interconnections; Power transmission lines; Routing; Solid modeling; Differential Pair; PCB; Return Path Discontinuities; Signal Integrity; Split Plane; Transmission Line; Via Hole; Void;

fLanguage

English

Publisher

ieee

Conference_Titel

Quality Electronic Design (ASQED), 2012 4th Asia Symposium on

Conference_Location

Penang

Print_ISBN

978-1-4673-2687-2

Type

conf

DOI

10.1109/ACQED.2012.6320490

Filename

6320490