DocumentCode :
3544668
Title :
The power analysis of interconnect structures
Author :
Zhang, Yan ; Ye, WIL ; Owens, Robert M. ; Irwin, Mary Jane
Author_Institution :
Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA
fYear :
1997
fDate :
7-10 Sep 1997
Firstpage :
25
Lastpage :
29
Abstract :
Interconnect structures play a more and more important role in low power computer design. Yet few investigations have been done in power analysis of interconnect structures. In this paper five designs of interconnect structures are implemented and a power analysis of interconnect structures that vary at the architecture level and gate level for different numbers of input ports is presented. The results based on these designs show that MUXes implemented with n-type pass transistors consume the least total power and set up power (power consumption in setting up the transmitting path). Crossbars consume the least transfer power (power consumption in transferring data). MUXes implemented with SPSD (Sympathetic Precharge Static Domino) gates have relatively lower delay especially for high fan-in interconnect structures. MUXes implemented with pass transistors have the lowest power-delay product for input ports numbers of 4, 8 and 16 while MUXes implemented with SPSD gates have the lowest power-delay product for interconnect structures which have 32 input ports
Keywords :
delays; digital integrated circuits; integrated circuit interconnections; SPSD; digital ICs; interconnect structures; n-type pass transistors; power analysis; power-delay product; sympathetic precharge static domino gates; CMOS logic circuits; Computer architecture; Computer science; Decoding; Delay; Design engineering; Energy consumption; Power dissipation; Power engineering and energy; Power engineering computing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ASIC Conference and Exhibit, 1997. Proceedings., Tenth Annual IEEE International
Conference_Location :
Portland, OR
ISSN :
1063-0988
Print_ISBN :
0-7803-4283-6
Type :
conf
DOI :
10.1109/ASIC.1997.616972
Filename :
616972
Link To Document :
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