Title :
Measurements on mechanical properties of boron-doped silicon materials for micro inertia sensor
Author :
Liu, Haipeng ; Gao, Shiqiao ; Niu, Shaohua ; Jin, Lei
Author_Institution :
State Key Lab. of Explosion Sci. & Technol., Beijing Inst. of Technol., Beijing, China
Abstract :
The capacitive structure of comb capacitive micromachined gyroscope is a kind of important structure. The mechanical properties of micro inertia sensor material had changed when the structures experienced high temperature boron diffusion, lithography and etching et.al. micromachined process. Therefore, it is necessary to measure the basic mechanical properties of boron-doped material in order to supply exact material parameters for design and fabrication of micro inertia sensor. With the rapid development of measurement technologies, the nano indentation technology had become an ideal method to obtain the mechanical properties of MEMS structures material accurately. We obtained the elastic modulus and hardness of heavy boron-doped silicon material using nano indenter. The experimental results showed that the elastic modulus and hardness of heavy boron-doped silicon material had increased comparing with the silicon material.
Keywords :
boron; diffusion; elastic moduli; elemental semiconductors; etching; hardness; lithography; microsensors; nanoindentation; silicon; Si:B; boron-doped silicon materials; capacitive structure; comb capacitive micromachined gyroscope; elastic modulus; etching; hardness; high temperature diffusion; lithography; mechanical properties; microinertia sensor; micromachined process; nanoindentation technology; Boron; Etching; Fabrication; Gyroscopes; Lithography; Mechanical factors; Mechanical sensors; Mechanical variables measurement; Silicon; Temperature sensors; comb capacitive structure; elastic modulus; hardness; heavy boron-doped silicon; nano indentation;
Conference_Titel :
Electronic Measurement & Instruments, 2009. ICEMI '09. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-3863-1
Electronic_ISBN :
978-1-4244-3864-8
DOI :
10.1109/ICEMI.2009.5274601